Microstructure on SiO2-surface active & passive isolated
The following two images demonstrate the difference between active and passive vibration isolation.
The sample consists of microstructures etched on SiO2-surface.
Zeiss LSM Pascal + TS150
The measurements were done by Prof. Hartl (FH Nuremberg, Germany)
with the Zeiss Laser Scanning Microscope Pascal (resolution 100x)
New modular TS200M
The TS200M has been developed to isolate medium and larger equipment (e.g. SEM) with the same performance as
achiveable with our table top systems. The modular configuration of the TS200M allows the user to adapt the
vibration isolation system perfectly to his application requirements. The modules will adjust themselves exactly and
balance different load distribution of the setup. The TS200M is small enough to set a rigid desk top, but it can
easily be expanded to support a large area by adding up single isolation modules.
The basic configuration of the TS200M starts with three isolation modules and is expandable to a maximum of twelve modules
for loads up to 2400 kg.
